Semiconductor
With the continuous development of semiconductor technology, the demand for micro nano processing technology is increasing day by day. Laser, especially ultrafast laser, with its unparalleled sharpness, unparalleled accuracy, and excellent processing capability, can handle various micro nano processing tasks, such as micro hole processing, micro groove processing, etc., precisely meeting the urgent demand for high-precision and high-efficiency processing solutions in the semiconductor field.
The Shenglei Leonis infrared picosecond series laser can be applied to wafer cutting and TGV drilling. The POD function ensures high consistency in the processing, uniform cutting lines, consistent hole spacing, and even hole spacing.
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Figure 1 TGV micropore diagram |
Figure 2 TGV borehole outline drawing |
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