In today's consumer electronics, products are constantly transforming and upgrading towards high precision, extreme thinness, and deep integration. In this process, a variety of new materials such as thin film materials, hard and brittle transparent materials, and specially made thin metal materials have been widely applied. Ultrafast lasers, with their extremely short pulse widths (usually in the picosecond or femtosecond range), can instantly transfer high energy without producing a heat affected zone, making them particularly suitable for processing heat sensitive materials. This characteristic enables ultrafast lasers to achieve high-precision and non-destructive processing in electronic circuit manufacturing, thereby meeting the demand for precision machining in modern electronic products